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NGFF M.2 (M Key) standard form factor

Español
  • MEC3H0E<br><font ='#888888' size='2%'>3D TLC</font>
MEC3H0E
3D TLC

Especificaciones

  • Flash Technology
  • 3D TLC
  • Capacity
  • 256GB~1TB
  • Interface
  • PCIe Gen4x4, NVMe
  • Storage Temperature
  • -55℃ ～ 95℃
  • Seq. Performance Read (max.)
  • 2,600 MB/s (estimated)
  • Seq. Performance Write (max.)
  • 2,000 MB/s (estimated)
  • Random 4K Read (IOPS max.)
  • 200,000 (estimated)
  • Random 4K Write (IOPS max.)
  • 200,000 (estimated)
  • Power Requirement
  • DC 3.3V
  • Power Consumption(max.)
  • 1185 mA (TBD)
  • Power Consumption (idle)
  • 1155 mA (TBD)
  • Dimension（mm）
  • 80.0 x 22.0 x 3.6
  • MTBF (est)
  • > 3,000,000 hrs
    *at 25 degrees Celsius , based on specification MIL-HDBK-217F part count method & Telcordia SR-332 Method
  • Operating Temp. (Standard)
  • 0°C ～ 70°C
  • Vibration
  • 15G, 10~2000Hz
  • Drop
  • 75cm
  • Shock
  • 1,500G@0.5ms
  • Power Shield
  • ●
  • End-to-End Data Protection
  • ●
  • TRIM
  • ●
  • S.M.A.R.T.
  • ●
  • SP SMART Utility
  • ●
  • Warranty
  • 3 years and within TBW

Características

  • NGFF M.2 (M Key) standard form factor
  • Compliant with NVMe Express 1.4
  • Support Data Security with AES 256 Encryption (Optional)
  • Support SP Toolbox SMART health monitoring software

Información del pedido

MEC3H0E
3D TLC

Form Factor NAND Interface Capacity Temp. P/N
M.2 2280 3D TLC PCIe4.0 256GB 0~70°C SP256GIMEC3H5EV0
M.2 2280 3D TLC PCIe4.0 512GB 0~70°C SP512GIMEC3H5EV0
M.2 2280 3D TLC PCIe4.0 2TB 0~70°C SP010TIMEC3H5EV0
Show P/N by Capacity:
256GB
Form Factor M.2 2280
NAND 3D TLC
Interface PCIe4.0
Capacity 256GB
Temp. 0~70°C
P/N SP256GIMEC3H5EV0

Descargar

Factsheet
Nombre Idioma File Format Versión Fecha Descargar
MEC3H0E EN pdf. v4.0 2022/03
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